Laser Bond Tester I
The standard measurement target is the thick aluminum wire bond in the post-process of power semiconductor manufacturing.
This product is a laser bond tester that can perform non-contact, non-destructive, and instantaneous measurements of aluminum wire bonds. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. The measurement method is a laser periodic heating joint interface measurement method. 【Features】 ■ Automatic measurement ■ Non-contact ■ Non-destructive ■ Instantaneous measurement *For more details, please refer to the PDF materials or feel free to contact us.
- Company：アイエルテクノロジー
- Price：Other
